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Filled-Via Processing and Sequential Laminations The requirement to fill vias is driven most often by routing density When high-density-area array components are utilized, the quantity of vias per square inch greatly increases in the local area under the device Buried vias or blind vias are frequently the solutions to through-via starvation Buried vias, unless otherwise prefilled, will fill with resin during final lamination The volume of resin necessary to fill the buried vias is dependent on the diameter, length, and total quantity Buried vias might straddle a single core, or might interconnect several cores and dielectric separations in a sub-lamination section If there is insufficient resin in the prepreg to fill the buried vias, those vias can starve bonding resin from the local area where they are concentrated.

To prevent the prepreg resin from entering the buried hole, the fabricator often is required to prefill the vias prior to a build-up lamination with a resin or paste formulation Other design constructions require blind vias that are planar and within the land pattern at the surface mount attachment locationsThese VIP structures free up real estate on the component attachment surfaces and provide enhanced signal integrity at high frequencies Prefilling internal buried vias or blind VIPs with a hole-fill resin can provide a more robust interconnect structure, improved lamination integrity, and a planar surface in the case of the blind vias 27351 Fill Materials Since the fill material is an additional fabrication material that becomes a part of the design construction, procurement documentation is required to specify a fill material type and thereby implement the via fill process.

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The selection and documentation of the fill material require the same consideration as the base laminate preference This is especially critical when targeting a lead-free-compatible process Currently, an industrybased material specification for via fill material does not exist Therefore, specific fill-material brands may be named on the drawing, or some other form of user/supplier agreement must be establishedThe fabricator has preferences for the type of material used for via fill Just as suppliers often have preferences for a specific solder mask brand, they also often prefer to use of a specific via fill material around which they have developed their principal processes Supplier preferences can be driven by specific via fill material characteristics, such as accessibility, equipment compatibility, process supportability, plateability, and/or shelf/pot life This may complicate source selection, or it might influence the use of a dedicated service center for the hole-fill process.

The fabricator may not always know the reliability of its preferred material for a given via structure or end-use environment Determining the properties of the various fill materials may be difficult for the user Obtaining properties from the material suppliers data sheets may be possible for some properties, whereas others are more difficult to obtain; for example, many manufacturers data.

Fig 529: Ball screw transmission [11]

0 1 0 1 0 1 0 1

TABLE 27.4 Common Via Fill Manufacturers and Material Properties Thermal conductivity (W/m/ K) N/A N/A N/A N/A 3.5 7.8 6.7 CTE under Tg (ppm) 40 40 32 24 35 40 45 CTE over Tg (ppm) 150 105 83 78 47 86 120

Type Non-conductive (Ceramic Filler) Non-conductive (Ceramic Filler) Non-conductive Non-conductive Conductive Conductive Conductive

Material3 (part number) PP 2795 PP 27943 PHP-900 IR-10F3 TCHP-200 DB4 (2 part) CB-100 Copper /Silver AE 3030 Copper/Silver3 SCHP-7901 Silver

Notes: Some via fill materials are not typically compatible with permanganate chemical processing. Confirm with the specific supplier before using. The denotation of N/A indicates that the data were not readily available. 1 Compatible with Plasma desmear, requires electroless followed by electrolytic processing. 2 Compatible with Plasma desmear, conventional electroless recommended but may be use direct electrolytic processing. 3 Capability with a lead-free profile should be verified; typically the higher Tg materials with a lower ppm above Tg will be more compatible.

sheets omit the modulus Table 274 provides a cross-reference for some of the more common material types with properties available Additional properties and performance data may also be found at the specific manufacturer web page 27352 Concerns and Common Defects Concerns have been associated with filled-via structures arising from a lack of process maturity and the potential impact on reliabilityThese concerns include plating adhesion, air entrapment (voids) created during the filling operation, CTE mismatch with the bulk resin, and the risk of overplanarization to remove excess resin Entrapped voids are suspected to have an effect on hole wall integrity due to outgassing; CTE expansion mismatch could have an adverse interaction with the material and copper CTE properties Overplanarization can grind down the plated hole wall knee, weakening the interconnect at the barrel plateThis is commonly called a reduction in wrap copper.

Fig 530: An inspection machine with a ball screw assembly [11]

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